High-Speed, Si-Proven On-Chip Interface for Multi-Die Systems
The Deep-I Die-to-Die (D2D) I/F solutions enables on-chip I/F logic to provide more reliable and high-speed solutions that enables higher performance and data reliability. The Deep-I Die-to-Die (D2D) I/F solutions are all Si-proven and mature memory interface solution in advanced process nodes.
State-of-the-art I/O transmitter (TX) and receiver (RX) circuit macro
supporting 3 Gb/s to 36 Gb/s per data wire on glass or organic substrates.
1-bit or n-bit wire interface supporting 3 Gb/s to 36 Gb/s per data wire. TX clock uses differential signaling, TX data uses single-ended signaling. Low-jitter on-chip PLL provides reliable internal clock and forwards clock to point-to-point or multi-drop RXs.
Transmitter IP1-bit or n-bit wire interface supporting 3 to 36 Gb/s per data wire. Automatic BIST operation at initialization by on-chip auto read/write leveling and DQS de-skewing timing digital calibration for reliable RX analog clock and data lanes.
Receiver IPBoth RX and TX circuits provide automatic built-in self-test (BIST) pattern generation and self-checking for the complete data path through a TX/RX byte group. Per-DQ and Per-DQS BIST supports various PRBS data patterns.
Self-Test IPClock RX receives 100 MHz reference clock input and provides low-power, high-speed differential clock output signal. Uses high-speed differential forwarded clock from TX group to sample data correctly.
Clock IPComplete die-to-die interface from TX to RX across glass or organic interposer
Si-proven, high-speed die-to-die interface for multi-chip systems
18 Gb/s and 36 Gb/s I/F design provides unidirectional or bi-directional clock and data bandwidth for maximum throughput.
Provide our valuable multi-chip module on glass or organic substrates for cost-optimized multi-die integration.
SI/PI (Signal and Power Integrity) analyzed, designed, verified for AI-powered applications requiring minimal latency overhead.
Advanced mixed-signal architecture with built-in reliability
Built-in self-test features for SI/PI-proven data reliability. On-chip read-write leveling, per-DQ de-skewing, and timing calibration.
Optional CRC/ECC data correction features for system reliability. Professional RDL routing and easy co-integration.
Full -40°C to 125°C industrial temperature range support with high-performance mixed-signal architecture for compact, low-power solutions.
Si-proven D2D I/F solutions with wide range of clock and data throughput from 3 Gb/s to 36 Gb/s.
Highest-performance 36 Gb/s die-to-die interface providing unidirectional or bi-directional clock and data bandwidth with on-chip PLL and BIST.
High-performance 18 Gb/s die-to-die interface with unidirectional or bi-directional clock and data bandwidth. On-chip auto calibration and BIST.
Configurable TX/RX circuit macro with 1-bit or n-bit wire interface, low-jitter on-chip PLL, and automatic BIST with PRBS pattern generation for complete data-path verification.
Clock RX receives 100 MHz reference clock and provides low-power, high-speed differential clock output. Forwarded clock architecture for point-to-point and multi-drop RX sampling.
Compare key specifications across our D2D I/F portfolio
Key specifications at a glance
Deep-I D2D I/F solutions are analyzed, designed, and verified by real Silicon for reliable multi-die integration.
Define data-rate targets (3~36 Gb/s), signaling type (differential CLK, single-ended data), and multi-chip topology for glass or organic substrate.
High-performance mixed-signal (analog/digital) TX/RX macro design with low-jitter on-chip PLL, BIST pattern generation, and CRC/ECC data correction features.
Signal and power integrity analysis for point-to-point and multi-drop topologies. Professional RDL routing optimization for easy co-integration.
Real-Si fabrication with automatic BIST validation at initialization. Per-DQ and per-DQS testing with PRBS patterns across -40°C to +125°C industrial range.
From concept to real-Silicon D2D integration — see Deep-I's D2D I/F solutions in action.
Contact our technical team to discuss your requirements and discover how Deep-I's D2D I/F solutions can accelerate your multi-die system development.