
Professor GyungSu Byun
Principal Investigator
Prof. Byun received the Ph.D. degree in EE (Electrical Engineering) from the UCLA, Los Angeles, California, USA. He is currently Full Professor and Director of the AI-powered Integrated Circuits/Systems (AIC) Lab with the Dept. of Electrical and Computer Engineering (ECE) of Inha University, Korea.
From 1999 to 2005, he was a Sr. Engineer with Samsung Electronics, where he worked on the design of high speed DRAMs such as DDR2, GDDR3, Rambus and XDR. In 2006, he was a research intern with Intel where he worked on the design of a cache memory and a 3D CMP with RISC core architecture. From 2007 to 2011, he was a Sr. Engineer with Inphi (acquired by Rambus and Marvell), where he worked on the design of advanced memory buffer, clocking circuit, and high speed IO circuit design between multi-core CPU and DRAM.
His research area includes AI-powered Analog IC and AI Systems design for energy-efficient high-performance computing, wireline/wireless communication and RF/THz electronics for sensing/imaging and biomedical applications. He is the author/co-author of over peer-reviewed 93 journal/conference papers/patents in the field of electronic circuits.
Prof. Byun was the recipient of the prestigious NSF CAREER Award (2014), NSF-FRS Award (2013) and the NSF BRIGE Award (2012).
Professional Experience
Awards & Honors
Editorial Boards & Technical Program Committee Activities
Serving as a reviewer and editorial board member for leading journals in the field:
- IEEE Communication Magazine (CM) IF8.3
- IEEE Journal of Solid-State Circuits (JSSC) IF4.6
- IEEE Transactions on Circuits and Systems-I (TCAS)-I IF5.2
- IEEE Transactions on Circuits and Systems-II (TCAS)-II IF4.0
- IEEE Transactions on Biomedical Engineering (TBME) IF4.4
- Nature Scientific Reports (SR) IF4.9
- IEEE Transactions on Very Large Scale Integration Systems (TVLSI) IF2.8
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) IF2.7
- ACM Transactions on Embedded Computing Systems (TECS) IF2.8
Additionally serves as a technical program committee member and reviewer for premier international conferences in integrated circuits and systems.