Research
Overview
Four interconnected research pillars — from analog IC design and AI hardware to digital healthcare biosensors and RF communication systems.
Four Pillars of Innovation
Click any area to explore detailed research topics, publications, and results
Memory Interface & Mixed-Signal IC
High-speed DDR5/6, HBM memory interfaces, SerDes signaling, and low-power analog circuits for server and mobile platforms.
- DDR5 RCD & Data Buffer — 9600+ MT/s Si-proven
- High-speed SerDes & clock/data recovery
- Sub-1V ultra-low-power analog design
Neural Accelerators & AI Hardware
Energy-efficient NPU accelerators, neuromorphic computing, in-memory AI processing, and HBM/PHY interfaces for AI workloads.
- 100+ TOPS edge AI accelerator at 20 TOPS/W
- HBM3E controller & ultra-high-speed PHY
- Neuromorphic spiking neural network circuits
AI Biosensing & Health Monitoring
Wearable PPG/ECG biosensors, non-invasive blood glucose estimation, and AI-powered diagnostic systems for precision medicine.
- Multi-parameter wearable health band (HR/SpO2/ECG)
- Non-invasive blood glucose via multi-wavelength PPG
- Motion artifact cancellation & HRV analysis
Wireless Communication & RF IC
5G/6G mmWave transceivers, ultra-low-power IoT RF, sub-THz chipsets, and wireless power transfer IC systems.
- 28GHz phased array beamformer — EIRP 45dBm
- Sub-THz 100–300GHz transceiver for 6G backhaul
- Sub-mW IoT transceiver with 10-year battery life
Research Impact
Integrated expertise spanning the full IC design stack